| 1. | Alumina ceramic substrates for thin film integratedcircuits
薄膜集成电路用氧化铝陶瓷基片 |
| 2. | Alumina ceramic substrates for microwave integrated circuits
微波集成电路用氧化铝陶瓷基片 |
| 3. | Alumina ceramic substrates for thick film integratedcircuits
厚膜集成电路用氧化铝陶瓷基片 |
| 4. | Ceramic substrate cutting , drilling , scribing
陶瓷基板切割钻孔画线2 |
| 5. | Wafer ceramic substrate application
晶圆与陶瓷基板应用 |
| 6. | Test method for biaxial flexure strength modulus of rupture of ceramic substrates
陶瓷基底的双轴抗挠强度 |
| 7. | Cadmium contained in the cadmium oxide of a thick film ceramic substrate
厚膜陶瓷基质的氧化镉中所含的镉。 |
| 8. | Ceramic substrate printed board
导线胶印制板 |
| 9. | Test methods for gross camber of ceramic substrates for thick film applications
厚膜器件陶瓷基片横向弯曲度的试验方法 |
| 10. | Thin copper films prepared by chemical vapor deposition on glass - ceramic substrates
玻璃陶瓷基板上铜薄膜的化学气相沉积 |
